April 17, 2020 – Qualcomm Technologies, Inc. and BOE Technology Group Co., Ltd. have this week announced their plans to establish a strategic collaboration to develop innovative display products featuring Qualcomm 3D Sonic ultrasonic fingerprint sensors. The collaboration is expected to extend from mobile and associated 5G technologies to XR and IoT.
According to Qualcomm, its own broad product portfolio combined with BOE’s expertise in interface devices and smart IoT systems, makes this an ideal collaboration for the 5G era, in which consumers can expect performance improvements resulting from the tight integration of both companies’ multiple key technologies, including sensors, antennae, and display picture processing.
Anticipating the signing of a collaboration agreement, both companies have started working on incorporating value-added and distinctive features to BOE’s flexible OLED panels, including the enhancement of fingerprint scanning solutions for use on smartphones with the addition of the Qualcomm 3D Sonic sensor.
The collaboration is also expected to result in a streamlined supply chain and reduced bill of materials (BoM), as well as reduced research and development expenses.
“Qualcomm Technologies continuously strives to improve our collaboration in China, and collaboration with BOE will be another example of the dedication and our long-term commitment to driving innovations in this vibrant ecosystem,” said Roawen Chen, Senior Vice President and Chief Operations Officer, QCT, Qualcomm Technologies, Inc.
Chen added that, looking forward, the two companies could end up collaborating on extended reality solutions for the consumer market, and commented: “We look forward to further strengthening our innovative collaborations with BOE in key areas like 5G, XR and IoT.”
Image credit: Qualcomm Technologies/BOE Technology Group